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Biomass Chemical Engineering ›› 2019, Vol. 53 ›› Issue (5): 9-14.doi: 10.3969/j.issn.1673-5854.2019.05.002

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Rheological Behaviors and Curing Properties of Synergistic Cross-linked Soybean Based Adhesives

Guangbin WANG1,Lijun WANG1,Jiabao CHEN1,Ling LI1,Chunpeng WANG1,2,3,Fuxiang CHU1,2,3,Yuzhi XU1,2,3,*()   

  1. 1. Institute of Chemical Industry of Forest Products, CAF; National Engineering Lab. for Biomass Chemical Utilization; Key Lab. of Chemical Engineering of Forest Products, National Forestry and Grassland Administration; Key Lab. of Biomass Energy and Material, Jiangsu Province, Nanjing 210042, China
    2. Research Institute of Forestry New Technology, CAF, Beijing 100091, China
    3. Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, Nanjing Forestry University, Nanjing 210037, China
  • Received:2018-04-17 Online:2019-09-30 Published:2019-09-27
  • Contact: Yuzhi XU E-mail:xuyuzhi@icifp.cn
  • Supported by:


Soybean-based adhesives with good rheological behaviors and curing properties were made of soybean flour by synergistic modification of aqueous polyamide and isocyanate. The effect of various modifiers on the rheological behaviors was investigated by using rotational rheometer. The results showed that the soy-based adhesives were pseudoplastic fluid, and the rheological behavior was better when 10% aqueous polyamide was added, but the isocyanate cross-linking agent had no influence on the rheological behavior of these adhesives at room temperature. Through the dynamic temperature scan mode of the rheometer test, it was found that the amount of isocyanate had great influence on the storage modulus and loss modulus of soybean adhesive. The bonding strength was 0.74 MPa and meeting the national board Ⅱ requirements(≥ 0.70 MPa) when 10% aqueous polyamide and 4% isocyanate were added simultaneously, which indicated that the cross-linking reaction happened between the aqueous polyamide/isocyanate synergistic cross-linking system and soy protein molecules.

Key words: soy-based adhesives, synergistic cross-linking, rheological behaviors, curing properties, bonding strength

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